TONG HSING ELECTRONICS PHILS. INC.

 

Tong Hsing Electronics Phils. Inc. is one of the leading IC Hybrid assembly houses specializing on Chip Scale Package (CSP) – Land Grid Array (LGA) or Ball Grid Array (BGA) packages and other devices such as PCB assembly with Surface Mount Technology (SMT) and Chip on Board (COB) processes, Multi Chip Modules especially on RF Modules, Image Products and Ceramic Assembly manufacturing using Thick Film and DPC process. Clean room environment ranges from class 10, 100, 1000, 10K and 100K.

DUAL-SOURCE STRATEGY


Tong Hsing Electronics Phils. Inc. is one of the leading IC Hybrid assembly houses specializing on Chip Scale Package (CSP) – Land Grid Array (LGA) or Ball Grid Array (BGA) packages and other devices such as PCB assembly with Surface Mount Technology (SMT) and Chip on Board (COB) processes, Multi Chip Modules especially on RF Modules, Image Products and Ceramic Assembly manufacturing using Thick Film and DPC process. Clean room environment ranges from class 10, 100, 1000, 10K and 100K.


VISION:

Excellence in Customer Electronics Manufacturing


MISSION:

To establish a leading edge in custom electronics manufacturing


by offering world class services to ensure long-term business success of the company.


Key Factors

✔ Risk Management

✔ Human Resources Abundance

✔ Work Ethic - Ingenuity & dedication towards work

✔ Flexibility

✔ Easily Adaptable to English Language

✔ Government Support

✔ Availability of Industrial & Technical Support    


Contact Us and Invest in Tong Hsing Philippines today!

103 Prosperity Avenue Carmelray international Business Park

Brgy. Canlubang, Calamba City, Laguna, Philippines.

Tel.nos.: (049) 549-4250 / (049) 549-4252

info@net.tonghsing.ph

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